News

SAMPLES AVAILABLE NOW !

The newest addition to ETIC’s line of interpolation devices – ET2110. This device provides either 1X or 10X interpolation to complement the already available options of 2X, 4X, and 5X. (Refer to the data sheets for the existing products, ET2015 and ET2024.) The new device is available in the same package, and with the same pin assignments, as the two existing versions. Satisfy multiple interpolation options without the need to change the board layout.

9560 now offered for 5V only applications.

ETIC has changed the test screening for the 9560 device, targeting performance characterization at 5V only. Operation at higher VCC values will not be guaranteed.

MARKING CHANGES !

Due to limitations on many of the small packages, ETIC has omitted the “ET” prefix in its part numbers on some devices. For example, a device that was formally marked “ET7272B” may now be marked as “7272B”. Also added to the marking will be the lead-free designator, “-LF”. It is the addition of this designator that has forced some changes in the part number as marked on the package body. Neither the die inside the package, nor the specifications, have changed in any way.

LEAD-FREE Packaging -

As stated on the home page, ETIC is now providing many of its devices in lead-free format. The previous finish on the device leads was Sn/Pb (85/15). This has been changed to a 100% matte tin (Sn) finish, in order to comply with restrictions on hazardous materials as set forth in the European Commission’s directive.

Soldering -

Molded (plastic) IC packages are sensitive to rapid changes in ambient temperature, including the thermal shock of reflow soldering. The greatest problem is with the evaporation (and expansion) of moisture in the package cavity, which may cause the body of the device to crack open. This is normally referred to as the popcorn effect.

Particularly sensitive are the thinner packages, such as the TSSOP types. Of course, the degree of thermal shock is a significant factor in controlling the popcorn effect. The higher the temperature, the greater the probability of this phenomenon. Since the lead-free directive also addresses the solder used to mount devices to a PCB, the standard Sn/Pb eutectic solder is being phased out. Replacing it will be a variety of alloys, all of which are likely to require slightly higher reflow temperatures. This will increase the probability of the popcorn effect. To combat this, new mold compounds are formulated to provide greater moisture resistance, and therefore offset the affects of higher reflow temperatures. ETIC has converted to new mold compounds which satisfy both the environmental concerns, (green initiative), and the need for lower sensitivity to moisture.

Devices delivered in the traditional manner, without any form of “dry packaging” to protect against moisture, might require baking immediately prior to soldering. This will eliminate any trapped moisture and prevent damage via the popcorn effect. ETIC can ship devices in a dry pack configuration as an option, at an additional cost.

In all cases, the user is responsible for the effects of subsequent processing on the device. The need for conditioning processes, in order to prevent damage during soldering, should be evaluated by the user. ETIC’s workmanship and construction guarantee will not cover damage which may occur during soldering.